System Business
Components Business
Sputter(In-line, Cluster)
- Al, Ti, TiN, Ta, PbO, ITO, Cr and etc
- Applied wafer 2” ~ 12”(300㎜)
- Glass 100 x 100㎜ ~ 2,000 x 2,200㎜
- Substrate Rotation ( 1~10 rpm )
- Deposition Uniformity : <5%
- Particle Rate : 0.05ea/㎠ at 0.1㎛
- Pre-heating (RF Etching)
- Heater Uniformity : <3%
- Loading station & Process Module
- Transfer Module & Process Module