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product information

Product Information

System Business

Components Business

Sputter(In-line, Cluster)

홈으로  > Product Information  > System Business  > Sputter(In-line, Cluster)
Sputter(In-line, Cluster)

applications

  • Al, Ti, TiN, Ta, PbO, ITO, Cr and etc
  • Applied wafer 2” ~ 12”(300㎜)
  • Glass 100 x 100㎜ ~ 2,000 x 2,200㎜

specification

  • Substrate Rotation ( 1~10 rpm )
  • Deposition Uniformity : <5%
  • Particle Rate : 0.05ea/㎠ at 0.1㎛
  • Pre-heating (RF Etching)
  • Heater Uniformity : <3%

System Configuration

  • Loading station & Process Module
  • Transfer Module & Process Module